| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package for an optical semiconductor device, capable of enhancing the reliability of the electrical properties, without impairing the functions of a built-in surge protective element during an injection-molding, and to provide an optical semiconductor device which uses the same. <P>SOLUTION: In this package having a first lead 11 and a second lead 12 which are opposite to each other, by fixing a surge protecting element 13 on a second main face of the second lead 12 and by connecting a second main face of the surge protecting element 13 and a second main face of the first lead 11 with a third lead 14 which is a metal plate, during forming a resin-made outer periphery 15 by injection-molding, even if molten resin is injected from the side of a second main face of the third lead 14, the third lead 14 will not be pushed down or be broken. <P>COPYRIGHT: (C)2009,JPO&INPIT |
