发明名称 LEVELING DEVICE OF VEHICULAR HEADLIGHT
摘要 PROBLEM TO BE SOLVED: To reduce external force conventionally applied as a stress directly to solder that is electrically connected between a wiring and a terminal on a printed wiring board in a leveling device of a vehicular headlight. SOLUTION: According to the invention, a leveling device 6 is provided with housings 9, 10, a driving device such as a motor 11, a printed wiring board 14, a shaft 12, and a connector part 13. The connector part 13 is composed of three male terminals 22 that are electrically connected to the printed wiring board 14, a base 23 that holds the male terminals 22, and a fixing piece 40 that fixes the base 23 to the printed wiring board 14. As a result, according to the invention, even if external force is applied to the male terminals 22, the external force is received by the male terminals 22, the base 23 and the fixing piece 40 thereby external force transmitted to the printed wiring board 14 as a stress is reduced. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009158207(A) 申请公布日期 2009.07.16
申请号 JP20070333073 申请日期 2007.12.25
申请人 ICHIKOH IND LTD 发明人 SUGIMOTO TAKEKI;KOJIMA MASARU;IWASHITA HIROAKI
分类号 F21S8/10;B60Q1/06;F21V14/04;F21W101/10 主分类号 F21S8/10
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