| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid-state imaging device that can prevent a decrease in mounting yield and a decrease in mounting reliability and has good productivity and high heat dissipation characteristics while making electronic equipment compact and thin, and to provide a method of manufacturing the same. SOLUTION: Metal wiring 7 buried in a base 2 has a metal exposure portion 12 exposed on an upper surface of the base 2 between an internal terminal portion 8 and an external terminal portion 9; and a connection portion 13 connecting the external terminal portion 9 of the metal wiring 7 and the metal exposure portion 12 to each other has a dam hollowed in a recessed shape. Consequently, when no solder ball is mounted on the external terminal portion 9, bleeding from a sealing resin 5 along an upper surface of the base 2 in a process halfway during manufacture is stopped by the recessed dam of the connection portion 13 even in such a case to serve as a breakwater, thereby preventing the bleeding from covering the external terminal portion 9. COPYRIGHT: (C)2009,JPO&INPIT
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