| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin sealing molding method for electronic apparatus preventing a wiring board from warping at injecting and charging a resin without fail while obtaining high reliability. SOLUTION: A submodule 10' consisting of the wiring board 3, a base 1 and a connector 3 is set in a forming die 20. A heat-hardening resin is injected and charged in the forming die 20 to integrally seal-form the entire surface of the wiring board 3 and a part of the base 1 and the connector 2 with the heat-hardening resin. In this case, bosses 25a, 25b and 25c are protrusively provided to the inner surface of the forming die 20 so as to reach the wiring board 3 for preventing the wiring board 3 from warping at injecting and charging the heat-hardening resin. COPYRIGHT: (C)2009,JPO&INPIT
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