| 摘要 |
The invention relates to a process for producing at least one air gap in a microstructure, which comprises: a) the supply of a microstructure comprising at least one gap filled with a sacrificial material, this gap being limited over at least part of its surface by an impermeable membrane but which may be rendered permeable by the action of a chemical etchant, this etchant also being capable of degrading the sacrificial material; b) the contacting of the microstructure with said chemical etchant in order to make the membrane permeable and degrade the sacrificial material; and c) the removal of the chemical etchant from the microstructure; and in which the chemical etchant is a fluid containing hydrofluoric acid and/or ammonium fluoride. Applications: Microelectronics and micro-technology.
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