发明名称 INGOT CUTTING APPARATUS AND CUTTING METHOD
摘要 <p>Disclosed is an ingot cutting apparatus characterized by comprising at least an ingot supporting pad for supporting the cut ending portion of an ingot from below at the position of a clearance of a cutting table for cutting the ingot with a blade, and a pad lifting mechanism for bringing up the ingot supporting pad from below into close contact with the ingot. Without being influenced by the step of the clearance portion of the cutting table, therefore, the ingot cutting apparatus prevents the cut-ending portion of the ingot from being cracked, so that the apparatus can improve the production yield while eliminating the maintenance for adjusting the cutting table. Also disclosed is a cutting method using the ingot cutting apparatus.</p>
申请公布号 WO2009087723(A1) 申请公布日期 2009.07.16
申请号 WO2008JP03828 申请日期 2008.12.18
申请人 SHIN-ETSU HANDOTAI CO., LTD.;NISHINO, HIDEHIKO;TSUNODA, SHIGEHARU 发明人 NISHINO, HIDEHIKO;TSUNODA, SHIGEHARU
分类号 B28D7/04;B24B27/06;B28D5/04;C30B35/00;H01L21/304 主分类号 B28D7/04
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