发明名称 FLEXIBLE PRINTED WIRING BOARD, MANUFACTURING METHOD OF THE SAME, AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a flexible printed wiring board capable of providing a uniformly-impedance-controlled electromagnetic shielding effect for the whole of a wiring region of a transmission line. SOLUTION: This flexible printed wiring board is provided with: a signal layer 13 formed on one-side surface of a base layer 11; a cover layer 14 formed by covering the signal layer 13; a first electromagnetic shield layer 15 formed by covering the outside surface of the cover layer 14; a second electromagnetic shield layer 16 formed by covering the other-side surface of the base layer 11; and an interlayer joint pattern 12G arranged on the signal layer 13, and having one-side surface jointed to the first electromagnetic shield layer 15 and the other-side surface jointed to the second electromagnetic shield layer 16 to conductively joint the first and second electromagnetic shield layers 15 and 16 to each other. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009158850(A) 申请公布日期 2009.07.16
申请号 JP20070338027 申请日期 2007.12.27
申请人 TOSHIBA CORP 发明人 KARASAWA JUN;KANO TERUSHIGE
分类号 H05K1/02 主分类号 H05K1/02
代理机构 代理人
主权项
地址
您可能感兴趣的专利