发明名称 CUTTING METHOD AND CUTTING DEVICE FOR ADHESIVE FILM
摘要 PROBLEM TO BE SOLVED: To provide a device capable of cutting an adhesive film in good workmanship without causing a cover film or the like to make dislocation on an adhesive layer or exfoliation when the adhesive film is deformed through the action of a shearing force generated during cutting. SOLUTION: The cutting device 1 is to cut the adhesive film 2 being transported into strips and is equipped with a cutter mechanism 10 and a heating mechanism (heating means) 3. The cutter mechanism 10 is composed of an upper blade unit 11A in which a plurality of upper blades 11 are arranged in row in the axial direction and a lower blade unit 12A in which a plurality of lower blades 12 are arranged in row in the axial direction. The heating mechanism 3 is disposed at the upstream side of the cutter mechanism 10 and is composed of a blower 31, a heater 32, a temperature sensor 33, and a temperature control part 34. The blower 31 is connected with the heater 32 through a duct 35, and disposed to directly blow a hot wind to the adhesive film 2. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009154290(A) 申请公布日期 2009.07.16
申请号 JP20090096306 申请日期 2009.04.10
申请人 SONY CHEMICAL & INFORMATION DEVICE CORP 发明人 KAWAI TOMONAGA
分类号 B26D7/10 主分类号 B26D7/10
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