| 摘要 |
PROBLEM TO BE SOLVED: To provide a MEMS module which is protected against mechanical stress such as external vibration or impact and can always exhibit good characteristics without considering a structure of a MEMS device although the MEMS module has such a structure that the MEMS device is not in direct contact with a cushioning material. SOLUTION: An aperture is provided in a lead pin insertion hole 17 provided on a pedestal 19 of a package 3 for mounting the MEMS device 2 and then a lead pin 20 is inserted. The aperture is filled with the flexible and insulative cushioning material 22 to fix the lead pin 20 to the pedestal 19. COPYRIGHT: (C)2009,JPO&INPIT
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