MANUFACTURING METHOD FOR CONDENSER-PACKAGED DEVICE, AND MANUFACTURING METHOD FOR CONDENSER-PACKAGED PACKAGE

摘要

Provided are a method for manufacturing highly efficiently a condenser-packaged device, in which a thin-type condenser having fine through viae are packaged not as discrete parts in an electronic device, and a method for manufacturing a condenser-packaged package, in which the condenser-packaged device is packaged in a circuit substrate. The condenser-packaged device manufacturing method comprises a step of forming a condenser in a condenser substrate, a step of forming a recess of such a depth in a predetermined region of the condenser substrate as does not extend through the condenser substrate, a step of forming an inter-layer insulatingfilm and a conductor (including a recess inside) on the condenser substrate and forming a condenser-packaged element by an individualization, a step of mounting the condenser-packaged element in an electronic element such that the condenser forming face of the condenser substrate and the electronic element may confront each other, a step of thinning the condenser substrate so that the conductor in the recess may be exposed to the outside, and a step of forming the condenser-packaged device by the individualization.