| 摘要 |
PROBLEM TO BE SOLVED: To provide a device for supplying and discharging a wafer ring with a simple device configuration, which achieves space saving, simple control mechanism, and faster device processing. SOLUTION: Between a supply magazine 2 and a ring moving mechanism 3 of a wafer ring supplying and discharging device 1, a ring transportation mechanism 4 which receives a wafer ring R from the supply magazine 2 and transports it to the ring moving mechanism 3 is provided. A ring ejecting mechanism 5 receives the processed wafer ring R by the ring moving mechanism 3 and ejects it from a predetermined ejecting position. A housing magazine 6 houses the processed wafer ring R. The ring ejecting mechanism 5 sequentially feeds the processed wafer rings R to the housing magazine 6, then ejects them. COPYRIGHT: (C)2009,JPO&INPIT
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