发明名称 CONDUCTIVE SUBSTRATE FOR PLATING, MANUFACTURING METHOD THEREOF AND METHOD OF MANUFACTURING SUBSTRATE WITH CONDUCTIVE LAYER PATTERN, SUBSTRATE WITH CONDUCTIVE LAYER PATTERN, AND LIGHT TRANSPARENT ELECTROMAGNETIC WAVE SHIELDING MEMBER
摘要 PROBLEM TO BE SOLVED: To provide a conductive substrate for plating which easily manufactures a substrate with conductive layer pattern in high productivity by using the transferring method, and to provide a manufacturing method thereof and a method of manufacturing a substrate with conductive layer pattern, a substrate with conductive layer pattern, and a light transparent electromagnetic wave shielding member. SOLUTION: An insulation layer 3 made of DLC, an inorganic material or the like is formed on the surface of a conductive substrate 2, and a recess 4 is formed on the surface of the conductive substrate 2 with the insulation layer 3. The recess is made larger in width toward the direction of an opening in the insulation layer 3 by laser so as to form plating. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009158841(A) 申请公布日期 2009.07.16
申请号 JP20070337878 申请日期 2007.12.27
申请人 HITACHI CHEM CO LTD 发明人 SUZUKI KYOSUKE;TSUYAMA KOICHI
分类号 H05K9/00;G09F9/00 主分类号 H05K9/00
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