| 摘要 |
PROBLEM TO BE SOLVED: To avoid laser machining in a state wherein a processed surface of a wafer is not coated with a protective film. SOLUTION: A light irradiation means 76 irradiates the processed surface of the wafer 10, where the protective film is formed of a liquid resin containing a component absorbing light having a wavelength of ultraviolet light, with the light in the wavelength range of ultraviolet light, a detecting means 77 detects reflected light thereof, and if no reflected light is detected, an notification means 78 indicates that the processed surface is not coated with the protective film 10a, so when there is a region or portion which is not coated with the protective film 10a on the processed surface of the wafer 10, reflected light in the wavelength of ultraviolet light is not absorbed by the protective film 10a to be detected and then the state wherein the processed surface is not coated with the protective film 10a can be confirmed. Consequently, the result thereof is reported to take measures such as inspection of a coating means and re-formation of a protective film. COPYRIGHT: (C)2009,JPO&INPIT
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