发明名称 |
CIRCUIT BOARD HAVING AN ELECTRODEPOSITED COATING ON A CONDUCTIVE CORE WITHIN A VIA AND METHOD OF MAKING SAME |
摘要 |
A process for fabricating a circuit board includes: providing a substrate including a first electrically conductive core having a first insulating coating on a first side and a second insulating coating on a second side, forming an opening in the first and second insulating coatings and the first electrically conductive core, exposing an edge of the conductive core within the opening, and electrodepositing a third insulating material on the exposed edge of the first electrically conductive core. A circuit board fabricated using the process is also provided.
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申请公布号 |
US2009178838(A1) |
申请公布日期 |
2009.07.16 |
申请号 |
US20080972671 |
申请日期 |
2008.01.11 |
申请人 |
PPG INDUSTRIES OHIO, INC. |
发明人 |
WANG ALAN E.;OLSON KEVIN C.;PAWLIK MICHAEL L. |
分类号 |
H05K1/05;H05K3/42 |
主分类号 |
H05K1/05 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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