发明名称 |
PACKAGE FOR SEMICONDUCTOR DEVICE AND PACKAGING METHOD THEREOF |
摘要 |
A semiconductor device package and a method thereof are able to reliably package a semiconductor device on a substrate without using flux. The semiconductor device package includes a semiconductor device and a substrate reciprocally disposed with respect to the semiconductor device, wherein the substrate includes a side reciprocal to the semiconductor device on which there are formed a plurality of prominences surrounding an accommodation region where the semiconductor device is to be disposed. The method of packaging a semiconductor device includes preparing the semiconductor device, preparing a substrate, forming a plurality of prominences to surround an accommodation region on the substrate where the semiconductor device is to be disposed, dropping the semiconductor device within the accommodation region, and packaging the semiconductor device on the substrate. |
申请公布号 |
WO2009057927(A3) |
申请公布日期 |
2009.07.16 |
申请号 |
WO2008KR06340 |
申请日期 |
2008.10.28 |
申请人 |
OPTOPAC CO., LTD.;KIM, DEOK HOON;CHO, YOUNG SANG;LEE, HWAN CHUL |
发明人 |
KIM, DEOK HOON;CHO, YOUNG SANG;LEE, HWAN CHUL |
分类号 |
H01L21/60 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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