| 摘要 |
The method involves surrounding an electronic element in a hollow space (13) by a wall (18). A definite shape or geometry is inserted in a shaping device (11). A free-flowing compound, particularly casting compound (10) is filled in the hollow space in the area between the electronic element and the wall of the hollow space made of metal or plastic. The shaping device is detached by an enclosure. The compound is made of synthetic resin, particularly epoxy resin, where the synthetic resin is provided with a filler material, particularly ceramic filler material. Independent claims are included for the following: (1) an enclosure with a geometrically defined shape; and (2) a device for producing an enclosure of an electronic element, particularly sensor element. |
