| 摘要 |
<p>The invention relates to a laser machining device (1) and to a laser machining method. It furthermore relates to a machining station (2) equipped with at least one such laser machining device (1), and also to a machining system (3) which may comprise one or more of said machining stations (2). The laser machining device (1) has at least one laser head (7) and a supporting device (11), wherein the laser head is arranged on a movement unit (15), and the movement unit (15) has mobility limited within the potential movement options thereof. The laser beam (8) also has a limited operating region (9). The laser machining device (1) has a movable handling device (20) for one or more work pieces (6). The handling device (20) and movement unit (15) can be jointly controlled.</p> |
