STACKED SEMICONDUCTOR DEVICE, SEMICONDUCTOR SUBSTRATE, AND PROCESS FOR MANUFACTURING STACKED SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a stacked semiconductor device which prevents chipping from occurring easily in a manufacturing process.

SOLUTION: In the stacked semiconductor device, semiconductor substrates 8 each having a circuit region 9 in which bumps 7 are formed at a predetermined distribution density are stacked by bonding the bumps 7 thus forming a stacked semiconductor element, wherein dummy bumps 11 are formed on the periphery 10 of a semiconductor substrate 1 at a distribution density higher than that of the bumps 7 in the circuit region 9 in tight contact with the semiconductor substrate 1, and the dummy bumps 11 of the semiconductor substrates 1 are bonded to each other.

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