| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having a structure in which a wiring substrate is hardly detached from a supporting pole by suppressing the loosing of a screw for fixing the wiring substrate to have high reliability. SOLUTION: This semiconductor device 1 includes: at least one semiconductor element housed in a resin case 20; a plurality of supporting poles 40 fixed to the resin case 20; and a wiring substrate 50 supported by being screwed in the supporting poles 40, and includes a structure in which the supporting poles 40 penetrating the substrate 50 and the substrate 50 are engaged with each other. Such an engaging is performed by a convex portion 40aa formed on a side face of the supporting pole 40 penetrating the substrate 50 and a concave portion 50a formed in the wiring substrate 50. By a semiconductor device 1 having such a structure, the loosing of a screw 60 for fixing the substrate 50 is suppressed, so that a semiconductor device having high reliability is achieved. COPYRIGHT: (C)2009,JPO&INPIT |
