| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor light-emitting device which reduces the formation of cracks in a sealant. <P>SOLUTION: The manufacturing method includes a first step of mixing a depolymerized silane class or a silanol class having above 10 and below 50 wt.% against the dry weight of the sealant with an alcoholic solution containing an alkoxy silioxane to prepare a mixed solution, a second step of applying the mixed solution to a light-emitting element, a third step of evaporating the alcoholic solution component in the mixed solution and drying the mixed solution into the sealant, and a fourth step of curing the sealant. <P>COPYRIGHT: (C)2009,JPO&INPIT |
