| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive polyimide precursor composition which exhibits characteristics proper to a polyimide resin, such as, heat resistance, electrical characteristics, mechanical characteristics and noncombustibility and even exhibits high flexibility, by making a positive photosensitive polyimide that has a low dissolution rate for unexposed portion completed, and to provide electronic components that use the composition. <P>SOLUTION: The photosensitive polyimide precursor composition comprises, at least one polyimide precursor (that is, the polyimide precursor may be a blend of polyimide precursors), a photosensitive agent and a polar organic solvent, wherein the polyimide precursor comprises at least one aromatic tetracarboxylic acid dianhydride and at least one aromatic diamine. <P>COPYRIGHT: (C)2009,JPO&INPIT |
