发明名称 THERMALLY CONDUCTIVE STRUCTURE
摘要 A multi-layered honeycomb structure adapted to reduce and/or eliminate thermal deformation is disclosed herein. In some embodiments, walls of the honeycomb structure comprise a first layer, optionally, a second layer, and a core layer adjacent to the first layer or between the first and second layers. The first and second layers may be compositions of Inconel or other high strength materials. The core layer may be copper or another thermally conductive material. The core layer is adapted to transmit heat between a first region of a structure and a second region. In this manner, heat can be transferred from the heated region to an unheated region, thereby reducing the temperature difference between the regions and thus the amount of thermal deformation.
申请公布号 US2009178410(A1) 申请公布日期 2009.07.16
申请号 US20080191208 申请日期 2008.08.13
申请人 VERTECHS ENTERPRISES, INC. 发明人 STRAZA GEORGE C. P.
分类号 F02C7/24;B29C70/68;B32B3/12 主分类号 F02C7/24
代理机构 代理人
主权项
地址