| 摘要 |
An apparatus includes an implant delivery device configured to deliver an implant into a body. The implant delivery device includes a target member, an insertion member and an electronic circuit system. The target member has a distal end portion configured to be disposed within the body adjacent a target location. The insertion member is movably coupled to the target member. A distal end portion of the insertion member is configured to be disposed within the body and selectively coupled to the implant. The electronic circuit system is configured to produce an electronic signal in proportion to a distance between the distal end portion of the target member and the distal end portion of the insertion member when the target member and the insertion member are disposed within the body.
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