| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing apparatus capable of preventing occurrence of erosion and recess; and a manufacturing method of a semiconductor device capable of preventing occurrence of erosion and recess. <P>SOLUTION: This polishing apparatus polishes a surface of a substrate SB by relatively moving the substrate SB and polishing cloth CL while the surface of the substrate SB is being pressed against the polishing cloth CL supplied with a polishing solution SLp, and has a polishing head HD, and a metal supply part MS1. The polishing head HD presses the surface of the substrate SB against the polishing cloth CL supplied with the polishing solution SLp by applying pressure to the back surface side of the substrate SB. The metal supply part MS1 supplies a metal chemically reacting with the polishing solution SLp to the polishing solution SLp supplied to the polishing cloth CL in the outside of a region where the substrate SB contacts the polishing cloth CL. <P>COPYRIGHT: (C)2009,JPO&INPIT |
