| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device that dissipates heat suitably to the outside while preventing occurrence of crack reliably, and to provide an electronic apparatus with such a semiconductor device. <P>SOLUTION: A semiconductor device 10 includes a semiconductor chip 1, a metal die pad 2 for supporting and fixing the semiconductor chip 1, and a bonding film 3 for bonding the semiconductor chip 1 to the die pad 2. The bonding film 3 contains metal atoms, oxygen atoms bonding to the metal atoms, and leaving groups bonding to at least one of the metal atoms or oxygen atoms. When energy is applied to at least part of the bonding film 3, the leaving groups existing near the surface of the bonding film 3 leave from at least one of the metal atoms or oxygen atoms, and the semiconductor chip 1 and the die pad 2 are bonded by adhesiveness emerging in a region on the surface of the bonding film 3. <P>COPYRIGHT: (C)2009,JPO&INPIT |
