| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface mounting light-emitting diode and a light-emitting device for reducing a failure generation rate by actualizing connection not inclined for a mounting substrate through reduction of metal burrs during the cutting process at the time of manufacturing many surface mounting LED's by cutting from only one LED mounting substrate. <P>SOLUTION: The surface mounting light-emitting diode includes a supporting substrate of the angled-shape, an electrode provided in the end part side of the supporting substrate, a light-emitting diode chip provided on the one surface of the supporting substrate, and a resin mold covering a semiconductor element. This surface mounting light-emitting diode is characterized in that the supporting substrate is provided with a first side surface for mounting a light-emitting diode chip, a second side surface not in contact with the first side surface, a first end surface and a second end surface, and a mounting surface and an upper surface for mounting a wiring substrate, the electrode is provided with a first electrode part exposed to the first side surface and a second electrode part exposed to the second side surface, the mounting surface and first and second end surfaces are provided with electrodes, a cut-away part is formed to the corner part in the end surface side of the first electrode part and second electrode part, and the first electrode part and the second electrode part are electrically connected via a connecting hole penetrating the supporting substrate or the upper surface. <P>COPYRIGHT: (C)2009,JPO&INPIT |
