| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor apparatus improving electrical conductivity and thermal conductivity, and reducing weight. <P>SOLUTION: A semiconductor apparatus 10 includes: an insulating substrate 3; a metal bonding member 2 being disposed on the insulating substrate 3 and having a porous region 2a and a metal region 2b, the porous region 2a being provided with multiple pores 7 therein and being adjacent to the metal region 2b in a plane direction of the insulating substrate 3; a solder material 8 impregnated into the pores 7; a semiconductor element 1 disposed on the surface of the porous region 2a in the metal bonding member 2; and a bonding wire 6 connected to the surface of the metal region 2b in the metal bonding member 2. <P>COPYRIGHT: (C)2009,JPO&INPIT |
