| 摘要 |
PROBLEM TO BE SOLVED: To provide a SAW device in which an adhesive is prevented from being flowed out to the back surface of a piezoelectric substrate confronting an IDT when a SAW element is bonded to an internal mounting surface of a package, and a SAW module compacted by using the SAW device. SOLUTION: In a SAW resonator 1, a SAW resonance element 7 with an electrode pattern comprising reflectors 4a, 4b, an IDT 5 and a pad electrode 6 formed on the surface of the piezoelectric substrate 3 is bonded to the internal mounting surface of the package 2 in a cantilever manner by using an adhesive 8. The SAW resonator 1 has a structure in which an opening part of the package 2 is hermetically sealed by a lid member 9. In the SAW resonance element 7, a recessed part 11 is formed in predetermined depth on a face confronting the entire area where the IDT 5 is formed on the back surface of the piezoelectric substrate 3 by etching or machining, and a thick part 12a of a base end part of the piezoelectric substrate 3 is adhesively bonded to the mounting surface of the package 2 in a cantilever manner by using the adhesive 8. COPYRIGHT: (C)2009,JPO&INPIT
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