| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board assuring a packaging reliability of a surface-mounted component mounted on the wiring board, and requiring no restriction, change or the like of the designing of the wiring board and the arrangement of the surface-mounted component, and to provide a method for manufacturing the wiring board. SOLUTION: A core material layer 10 under the region with the surface-mounted component mounted are separated in an island shape through a low elastic resin layer (a stress reducing layer) 20 on the wiring board 1 with the surface-mounted component mounted. Consequently the wiring board 1 has a structure less likely to give the deformation of the whole wiring board 1 to the core material layer 10 positioning in the region 10in. The surface-mounted components of the semiconductor device or the like are mounted on the upper layer of the core material layer 10 positioning in the region 10in. The wiring board 1 is less likely to have the effect of the deformation of the whole wiring board 1 on the connection part between the surface-mounted component and the wiring board 1 to improve the packaging reliability of the wiring board. COPYRIGHT: (C)2009,JPO&INPIT
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