| 摘要 |
PROBLEM TO BE SOLVED: To reduce noise to an operational amplifier for a sensor. SOLUTION: In the semiconductor device 10 of a multi-chip package, a driver chip 20 having an analog circuit and a logic chip 30 having a digital circuit are mounted inside the same package. The driver chip 20 includes a power supply circuit for the logic chip, which prepares a logic chip power supply for the logic chip 30, and an operational amplifier group which amplifies detection signals from a plurality of sensors. The driver chip 20 is rectangular as a whole, and the plurality of operational amplifiers and a power supply circuit 450 for the logic chip are disposed at diagonal positions. COPYRIGHT: (C)2009,JPO&INPIT |
