| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a high frequency circuit suitable for miniaturization by surely soldering a single face of a fixing leg of a cover body to a land on a circuit substrate. <P>SOLUTION: In the high frequency circuit unit, an electronic component 2 mounted on a component mounting face 1a of the circuit substrate 1 is covered with the cover body 3 consisting of a metal plate, fixing legs 6 protruded from four corners of the cover body 3 are inserted into through-holes 4 of the substrate 1, and a copper foil land 5 provided around the through-holes 4 and the fixing leg 6 are soldered on the component mounting face 1a. The fixing leg 6 is press-molded to have a watershoot shape such that one side of front-back both faces thereof becomes a convex surface 6a and the other side becomes a concave surface 6b, and the convex surface 6a is set to face an outer circumference side of the circuit substrate 1 within the through-hole 4, whereby the convex surface 6a of the fixing leg 6 is soldered to the copper foil land 5. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
