| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive sheet sufficiently and stably adhering to the back surface of a lead frame and the back surface of a sealing resin without causing leakage of the sealing resin nor separating from the back surfaces in a sealing process, easily separable in a separation process, and capable of preventing adhesive deposit and fracture; and a thermosetting type resin composition used for it. <P>SOLUTION: This thermosetting type resin composition for a QFN contains an acrylonitrile-butadiene copolymer (a) and a compound containing two or more maleimide groups, and 200-400 pts. by mass of the compound (b) containing two or more maleimide groups is preferably included in 100 pts. by mass of the acrylonitrile-butadiene copolymer (a). This adhesive sheet for a QFN is composed by forming an adhesive layer formed of the thermosetting type resin composition for a QFN on one surface of a heat-resistant film. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
