| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of cutting a bonding member which controls that the number of chips per semiconductor substrate becomes small, prevents occurrence of a crack upon handling and working a bonding member even when the semiconductor substrate is thin and which does not require a plurality of facilities. SOLUTION: In the method of cutting the bonding member W, the bonding member W obtained by bonding the semiconductor substrate 22 where a circuit is formed and a support substrate 24 supporting the semiconductor substrate 22 is divided along scribe lines 26. The method is provided with a first cutting process for cutting the semiconductor substrate 22 and a part of thickness of the support substrate 24 and forming a first cutting groove 32 along the scribe line 26 from a semiconductor substrate 22-side in the bonding member W, a second cutting process cutting the most part of remaining thickness of the support substrate 24 and forming a second cutting groove 34 with respect to the scribe line 26 from a support substrate 24-side in the bonding member W, and a division process folding and dividing a non-through part of desired thickness, which is arranged by the first cutting groove 32 and the second cutting groove 34. COPYRIGHT: (C)2009,JPO&INPIT
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