| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of processing a wafer which does not leave a concave portion after removing a ring-like reinforcement, and has no risk of damaging a wafer during conveyance or handling. SOLUTION: In the processing method, the wafer has a device area where a plurality of devices are formed and has a peripheral surplus area surrounding the device area on the surface, a circular concave portion is formed at a part on the backside corresponding to the device area, and a ring-like reinforcement including the peripheral surplus area is formed on the peripheral side of the circular concave portion. The method includes: a step for forming a resin layer in the circular concave portion; and a step for grinding the ring-like reinforcement together with the resin layer. COPYRIGHT: (C)2009,JPO&INPIT
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