发明名称 |
Packaging structure, method for manufacturing the same, and method for using the same |
摘要 |
A packaging structure applied for a surface mounting process, comprising: a chip module having a packaging surface; and a pre-cured layer formed on the packaging surface of the chip module. As above-mentioned, the structure is employed for protecting the external surface of the wafer. The pre-cured layer is formed on pre-curing a gluing material and the gluing material is uniformly filled with the space between the connecting protrusions on the packaging surface. The pre-cured later is post-curing in a connecting process for mounting the connecting protrusions to the substrate so that the connecting strength is improved. Moreover, the rate of the packaging process is increasing.
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申请公布号 |
US2009179327(A1) |
申请公布日期 |
2009.07.16 |
申请号 |
US20080007716 |
申请日期 |
2008.01.15 |
申请人 |
HUANG CHUNG-ER;LIAO CHIH-HAO |
发明人 |
HUANG CHUNG-ER;LIAO CHIH-HAO |
分类号 |
H01L23/488;H01L21/58 |
主分类号 |
H01L23/488 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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