| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an inexpensive package for housing a semiconductor element, which is excellent in reliability in connection of a bonding wire and allows a high-frequency signal to pass at a high speed. <P>SOLUTION: The package for housing a semiconductor element 10 is provided with a cavity portion 14, formed by brazing a ceramic frame 13 on a heat sink plate 12 and used to mount a semiconductor element 11; and an external lead terminals 18 brazed on the upper surface of the ceramic frame 13 and having the upper surface as a connection portion to be connected to the semiconductor element 11 via bonding wires 21, and having the other terminal protruding to the outside. At least the semiconductor element 11, in the vicinity of the upper surface of the one terminal side of the brazed external lead terminals 18, is connected to the ceramic frame 13 via the bonding wire 21, wherein a connection portion in an electrically continuous state has a surface roughness of ≤0.1 μm for the center line average roughness as prescribed in JIS B0601. <P>COPYRIGHT: (C)2009,JPO&INPIT |
