| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board for an electronic component inspection device, which enables an electric connection with a printed board to be mounted, to be made through a bonding wire, and is easy to manufacture and fabricate at a relatively low price, especially, in a thin film forming stage. <P>SOLUTION: Disclosed is the wiring board 1 for the electronic component inspection device comprising: a base substrate 20 which has a plurality of ceramic layers (insulating layers) s6 to s9, a top surface 21, a reverse surface 22, and a side surface 23 positioned between peripheries thereof, and also has wiring layers 32, 34 and 36 formed among the ceramic layers s6 to s9 and a step portion 24 formed on the side surface 23 and having a pad 28 for external connection on a bottom surface 25; and a mounting substrate 2 which is mounted above a top surface 21 of the base substrate 20, and has a plurality of ceramic layers (insulating layers) s1 to s5, and also has a top surface 3 where inspection pads 6 are formed, a reverse surface 4, and wiring layers 14 and 16 to 18 formed among the plurality of ceramic layers s1 to s5, and the reverse surface 4 and the top surface 21 of the base substrate 20 being electrically connected by solder (h). <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
