| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a technique for shortening a time required for launching a semiconductor device employing a wire bonding, as a new product in the market. <P>SOLUTION: Bonding pad sets (first columns L1) each consisting of a plurality of bonding pads 4 arranged in a column along a first direction and bonding pad sets (second columns L2) each consisting of a plurality of bonding pads 5 arranged in a column along the first direction are provided along a second direction perpendicular to the first direction, the bonding pads 4 configuring the first column L1 and the bonding pads 5 configuring the second column L2 are each provided side by side on the same line as the second direction, and bonding wires are connected to a part or the whole of the plurality of bonding pads 4 configuring the first columns L1 or the plurality of bonding pads 5 configuring the second columns L2. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
