| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide slurry for CMP with which an excellent polished surface can be obtained through a CMP process of a manufacturing process of a semiconductor device and the throughput and yield of the manufacture of the semiconductor device can be improved as a result, and to provided a manufacturing method of the semiconductor device. <P>SOLUTION: The slurry for CMP as an embodiment of the present invention is characterized by containing one kind or two kinds or more of water-soluble polymer selected from a group of polyacrylic acid, polymethacrylic acid, and salts thereof of 1,000,000 to 10,000,000 in weight-average molecular weight,β-cyclodextrin, colloidal silica and water. The manufacturing method of the semiconductor device as an embodiment of the present invention is characterized by using the CMP slurry as the embodiment of the present invention for a touch-up polishing process. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
