| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate for a power module, for improving reliability of connection between a body to be bonded thereon and improving heat radiation performance by preventing the generation of surface defect on a wiring circuit copper plate and a solid copper plate. SOLUTION: The method of manufacturing the substrate 10 for power module is manufactured by thermally bonding copper plates 17, 17a on a ceramic substrate 11 (11a) and then etching the ceramic board to provide a wiring circuit copper plate 12 on one side and a flat copper plate 13 on the other. The manufacturing method includes: a step of allowing the one main surface of the ceramic substrate to abut on a baking jig 15 and thermally bonding the copper plate 17 provided with a protrusion 16 on the other main surface; a step of allowing the protrusion 16 to abut on the baking jig 15 and thermally bonding the copper plate 17a on the one main surface of the ceramic substrate; and a step of etching the copper plate 17 having the protrusion 16 and the copper plate 17a to remove a portion exposed from an opening of a resist film including the protrusion 16 and providing the wiring circuit copper plate 12 on the one main surface and the solid copper plate 13 on the other. COPYRIGHT: (C)2009,JPO&INPIT
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