NANOTOPOGRAPHY CONTROL AND OPTIMIZATION USING FEEDBACK FROM WARP DATA

摘要

Processing a wafer using a double side grinder (101) having a pair of grinding wheels (209). Warp data is obtained by a warp measurement device (103) for measuring warp of a wafer as ground by the double side grinder (101). The warp data is received and a nanotopography of the wafer is predicted based on the received warp data. A grinding parameter is determined based on the predicted nanotopography of the wafer. Operation of the double side grinder (101) is adjusted based on the determined grinding parameter.