| 发明名称 |
SEMICONDUCTOR DEVICE |
| 摘要 |
<p>A protective coating is formed on the surface of a semiconductor device. The surface is located on the side to which an extension portion of a wire connected to a pad of the semiconductor device is pulled. The protective coating is formed such that its height decreases toward the pad.</p> |
| 申请公布号 |
WO2009087561(A1) |
申请公布日期 |
2009.07.16 |
| 申请号 |
WO2009IB00014 |
申请日期 |
2009.01.07 |
| 申请人 |
TOYOTA JIDOSHA KABUSHIKI KAISHA;SENOO, MASARU |
发明人 |
SENOO, MASARU |
| 分类号 |
H01L23/485;H01L21/60;H01L21/607;H01L23/31 |
主分类号 |
H01L23/485 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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