| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To increase the number of semiconductor elements to be stacked while maintaining wire bondability when a semiconductor device is constituted by stacking semiconductor elements in multistage on a wiring board. <P>SOLUTION: A plurality of semiconductor elements 9 constituting a first element group 12 are stacked stepwise on a wiring board 2. On the first element group 12, a plurality of semiconductor elements 9 constituting a second element group 13 are stacked stepwise while being directed opposite to the first element group 12. A semiconductor element 9 on the lowermost stage in the second element group 13 is stacked directly above a semiconductor element 9 on the uppermost stage in the first element group 12 through an insulating adhesive layer 15 functioning as a spacer layer, and the element side end of a metal wire 14 connected with the semiconductor element on the uppermost stage is buried in the insulating adhesive layer 15. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
