| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed board having high interlayer connection reliability, and to provide a method of manufacturing the same. SOLUTION: The multilayer printed board 10 is constituted by alternately stacking a plurality of first resin films 15, each having a through-hole 11, conductor patterns 12 formed on both surfaces, and a charged through-hole 14 in which a conductor 13 is charged and formed in the through-hole together with the conductor patterns 12, and second resin films 22 which each have a via hole 21 and have no conductor pattern on both sides. A conductor 23 having inter-metal coupling to two opposite conductor patterns 12 is provided between two adjacent first resin films 15. The conductor 23 is formed by curing conductive paste or metal powder charged in a via hole 21. Conductor patterns 12 on both surfaces of each resin filhm 15 are electrically connected by the charged through-hole 14, and the two opposite conductor patterns 12 are electrically connected by the conductor 23. COPYRIGHT: (C)2009,JPO&INPIT |
