发明名称 ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide an adhesive composition which has excellent thermal creep resistance, hygrothermal creep resistance, and adhesion at a low temperature without being blended with organic solvents such as toluene or xylene, and which is suitable for plastic sheet laminates. SOLUTION: The adhesive composition contains: an ethylene-vinyl acetate copolymer-based resin emulsion which contains, as essential components, ethylene, vinyl acetate, and a polyfunctional monomer having at least two copolymerizable ethylenic double bonds, wherein the toluene-insoluble fraction is≥70 wt.%; an emulsion of an urethane resin containing sulfonate group and/or sulfamate group in the molecule; and a water-soluble or water-dispersible biuret type hexamethylene diisocyanate. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009155538(A) 申请公布日期 2009.07.16
申请号 JP20070337189 申请日期 2007.12.27
申请人 AICA KOGYO CO LTD 发明人 KUSHIDA MITSUGI
分类号 C09J123/08;C09J11/06;C09J175/04 主分类号 C09J123/08
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