| 摘要 |
The invention provides an end-face-processing jig that allows the formation of a reflectance control film on an end face of a semiconductor laser body while preventing possible degradation due to catastrophic optical damage (COD) of a semiconductor laser, and a method of manufacturing a semiconductor laser employing such an end-face-processing jig. A window part of the end-face-processing jig is made of at least one of an oxide and a nitride, and semiconductor laser bars are fixed by the end-face-processing jig so that their end faces are exposed through a window of the window part. In this condition, a reflectance control film is formed on the end faces of the semiconductor laser bars for the manufacture of a semiconductor laser. This prevents a metal from being taken in the reflectance control film, thus preventing the absorption of light caused by a metal taken in the reflectance control film. It is thus possible to form a reflectance control film on the end faces of semiconductor laser bars while preventing possible degradation due to COD of a semiconductor laser.
|
