发明名称 |
HIGHLY ELECTRICALLY CONDUCTIVE SURFACES FOR ELECTROCHEMICAL APPLICATIONS |
摘要 |
A method is described that can be used in electrodes for electrochemical devices and includes disposing a precious metal on a top surface of a corrosion-resistant metal substrate. The precious metal can be thermally sprayed onto the surface of the corrosion-resistant metal substrate to produce multiple metal splats. The thermal spraying can be based on a salt solution or on a metal particle suspension. A separate bonding process can be used after the metal splats are deposited to enhance the adhesion of the metal splats to the corrosion- resistant metal substrate. The surface area associated with the splats of the precious metal is less than the surface area associated with the top surface of the corrosion-resistant metal substrate. The thermal spraying rate can be controlled to achieve a desired ratio of the surface area of the metal splats to the surface area of the corrosion-resistant metal substrate. |
申请公布号 |
WO2009089376(A2) |
申请公布日期 |
2009.07.16 |
申请号 |
WO2009US30475 |
申请日期 |
2009.01.08 |
申请人 |
TREADSTONE TECHNOLOGIES, INC.;WANG, CONGHUA |
发明人 |
WANG, CONGHUA |
分类号 |
C25D5/02;C25D3/56;C25D7/06 |
主分类号 |
C25D5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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