发明名称
摘要 Printed circuit boards with integral high and low value resistors are efficiently produced. The method of their manufacture entails applying a first layer of a low resistance material onto a dielectric substrate in a predetermined thickness and pattern. The pattern defines the electrical lengths and widths of low value resistors, as well as pairs of terminal electrode pads for the high value resistors. A second layer of a high resistance material is applied between and in contact with the top surfaces of the facing ends of each member of the terminal pad pairs. The fixed lengths, widths and thicknesses of the patterned high resistance material determine the values of the high value resistors. Conductive metal terminals are provided at the ends of the low value resistors and at the distal ends of the high value resistor pad pairs to complete the resistors.
申请公布号 JP4297617(B2) 申请公布日期 2009.07.15
申请号 JP20000605449 申请日期 2000.01.18
申请人 发明人
分类号 H05K1/16;H01C1/032;H01C7/00;H01C17/06;H05K1/09;H05K3/38 主分类号 H05K1/16
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