发明名称 |
Multilayer passive circuit topology |
摘要 |
A multilayer passive circuit topology is disclosed. In one embodiment, a multilayer circuit is provided. The multilayer circuit comprises a multilayer inductor comprising a first set of parallel conductive traces formed on a first layer, a second set of parallel conductive traces formed on a second layer spaced apart from the first layer; and a plurality of vias that connect respective parallel conductive traces from the first and second layer to form inductor windings. The multilayer circuit further comprises a multilayer capacitor connected to an end of the inductor by a coupling via, the capacitor comprising a first conductive plate and a second conductive plate being spaced apart from one another and being formed on different layers. |
申请公布号 |
EP2079290(A2) |
申请公布日期 |
2009.07.15 |
申请号 |
EP20090150384 |
申请日期 |
2009.01.12 |
申请人 |
NORTHROP GRUMMAN SYSTEMS CORPORATION |
发明人 |
GOYETTE, WILLIAM R.;WINTER, FRANK B.;JOHNSTON, ERIC C.;PATEL, HARDIK |
分类号 |
H05K1/16;H01F17/00;H03H1/00;H05K3/42 |
主分类号 |
H05K1/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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