| 摘要 |
A paste composition for die attachment is provided to increase compatibility with epoxy resin and rubber resin and to ensure excellent reliability after curing while preventing the degradation of adhesive force after B-staging. A paste composition for die attachment comprises an epoxy 30-60 parts by weight, a rubber resin 15-35 parts by weight, an epoxy-rubber adduct 5-15 parts by weight, a hardener 5-20 parts by weight and an inorganic filler 7-20 parts by weight. The mixing ratio of liquid and solid is 3:7 - 7:3. The rubber resin is a mixture of one or at least two kinds selected from the group consisting of liquefied polybutadiene with molecular weight of 50,000, acrylonitrile butadiene, glycidyl acrylate, styrene-butadiene rubber, epoxy-terminated butadiene rubber and carboxyl-terminated butadiene rubber. |
